Ultraviolet light emitting diode

ABSTRACT

An ultraviolet light-emitting diode includes: a substrate; an n-type semiconductor layer disposed on the substrate; a mesa disposed on the n-type semiconductor layer and including an active layer and a p-type semiconductor layer; an n-ohmic contact layer contacting the n-type semiconductor layer; a p-ohmic contact layer contacting the p-type semiconductor layer; an n-bump electrically connected to the n-ohmic contact layer; and a p-bump electrically connected to the p-ohmic contact layer, wherein the mesa includes a plurality of branches, the n-ohmic contact layer surrounds the mesa and is disposed in a region between the branches, each of the n-bump and the p-bump covers an upper surface and a side surface of the mesa, and the p-bump covers at least two of the branches among the plurality of branches. Therefore, an optical output can be increased by reducing light loss, and a forward voltage can be lowered.

CROSS REFERENCE TO RELATED APPLICATION

This application is a Division of U.S. patent application Ser. No.16/246,565, filed on Jan. 14, 2019, which is a Bypass Continuation ofInternational Patent Application No. PCT/KR2017/007286, filed on Jul. 7,2017, and claims priority from and the benefit of Korean PatentApplication No. 10-2016-0090201, filed on Jul. 15, 2016, all of whichare hereby incorporated by reference for all purposes as if fully setforth herein.

BACKGROUND Field

Exemplary embodiments of the inventive concepts relate generally to aninorganic semiconductor light emitting diode, and more specifically, toa light emitting diode emitting deep-ultraviolet (UV) light having awavelength of 300 nm or less.

Discussion of the Background

In general, a light emitting diode configured to emit UV light having awavelength of 200 nm to 300 nm can be used in various applicationsincluding a sterilization apparatus, a water or air purifier, ahigh-density optical recording device, a light source for bio-aerosolfluorescent detection systems, and the like.

Unlike near-UV or blue light emitting diodes, a light emitting diodeemitting relatively deep-UV light includes a well layer containing Al,like an AlGaN layer. Due to such a composition of a GaN-basedsemiconductor layer, the deep-UV light emitting diode has asubstantially different structure from the blue light emitting diode orthe near-UV light emitting diode.

In particular, a typical deep-UV light emitting diode has a differentstructure from a typical blue light emitting diode or a typical near-UVlight emitting diode in terms of the shape and location of a mesa on ann-type semiconductor layer. That is, the mesa is biased from the centerof the n-type semiconductor layer to one side thereof on the n-typesemiconductor layer, a p-bump is formed on the mesa, and an n-bump isdisposed near the other side of the n-type semiconductor layer to bespaced apart from the mesa. In addition, such a conventional UV lightemitting diode is bonded to a submount by a thermal sonic (TS) bondingtechnique. For TS bonding, the n-bump and the p-bump are required tohave upper surfaces flush with each other. To this end, a stepadjustment layer is disposed under the n-bump.

Such a conventional UV light emitting diode generally has disadvantagesof low power output and high forward voltage. In particular, since thep-type semiconductor layer includes a p-type GaN layer for ohmiccontact, UV light entering the p-type semiconductor layer is absorbedand lost by the p-type semiconductor layer. In addition, since an n-typeohmic contact layer bonded to the n-type semiconductor layer absorbslight, light traveling towards the n-type ohmic contact layer isabsorbed and lost by the n-type ohmic contact layer. In the blue lightemitting diode, a reflective metal layer is adopted as the n-type ohmiccontact layer to reduce light loss, whereas, in the deep-UV lightemitting diode, the n-type ohmic contact layer is not likely to beformed of a reflective metal layer and occupies a relatively large area,thereby causing significant problems.

Moreover, since the typical UV light emitting diode does not allow useof light emitted through a side surface of the mesa, the typical UVlight emitting diode tends to reduce the side surface of the mesa asmuch as possible. That is, in the typical UV light emitting diode, themesa is formed to have a relatively large width. However, a distancefrom the n-type ohmic contact layer to a central region of the mesaincreases with increasing width of the mesa, thereby causing inefficientcurrent spreading and high forward voltage.

The above information disclosed in this Background section is only forunderstanding of the background of the inventive concepts, and,therefore, it may contain information that does not constitute priorart.

SUMMARY

Exemplary embodiments of the inventive concepts provide a UV lightemitting diode having a novel structure capable of improving electricalcharacteristics and/or light output.

Additional features of the inventive concepts will be set forth in thedescription which follows, and in part will be apparent from thedescription, or may be learned by practice of the inventive concepts.

In accordance with one exemplary embodiment of the inventive concepts, aUV light emitting diode includes: a substrate; an n-type semiconductorlayer disposed on the substrate; a mesa disposed on the n-typesemiconductor layer and including an active layer and a p-typesemiconductor layer; an n-ohmic contact layer contacting the n-typesemiconductor layer; a p-ohmic contact layer contacting the p-typesemiconductor layer; an n-bump electrically connected to the n-ohmiccontact layer; and a p-bump electrically connected to the p-ohmiccontact layer, wherein the mesa includes a main branch and a pluralityof sub-branches extending from the main branch; the n-ohmic contactlayer surrounds the mesa and is disposed in a region between thesub-branches; and each of the n-bump and the p-bump covers upper andside surfaces of the mesa.

In accordance with another exemplary embodiment of the inventiveconcepts, a UV light emitting diode includes: a substrate; an n-typesemiconductor layer disposed on the substrate; a mesa disposed on then-type semiconductor layer and including an active layer and a p-typesemiconductor layer; an n-ohmic contact layer contacting the n-typesemiconductor layer; a p-ohmic contact layer contacting the p-typesemiconductor layer; an n-bump electrically connected to the n-ohmiccontact layer; and a p-bump electrically connected to the p-ohmiccontact layer, wherein the mesa includes a plurality of branches; then-ohmic contact layer surrounds the mesa and is disposed in a regionbetween the branches; and each of the n-bump and the p-bump covers upperand side surfaces of the mesa, the p-bump covering at least two of thebranches among the plurality of branches.

It is to be understood that both the foregoing general description andthe following detailed description are exemplary and explanatory and areintended to provide further explanation of the invention as claimed.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings, which are included to provide a furtherunderstanding of the invention and are incorporated in and constitute apart of this specification, illustrate exemplary embodiments of theinvention, and together with the description serve to explain theinventive concepts.

FIG. 1 is a plan view of a UV light emitting diode according to oneexemplary embodiment.

FIG. 2A and FIG. 2B show a cross-sectional view taken along line C-C ofFIG. 1.

FIG. 3 is a schematic plan view of a mesa according to one exemplaryembodiment.

FIG. 4 is a schematic plan view of a UV light emitting diode accordingto another exemplary embodiment.

FIG. 5 is a schematic plan view of a UV light emitting diode accordingto a further exemplary embodiment.

FIG. 6 is a schematic sectional view of the UV light emitting diodeaccording to the exemplary embodiment, which is mounted on a submount.

DETAILED DESCRIPTION OF THE ILLUSTRATED EMBODIMENTS

In the following description, for the purposes of explanation, numerousspecific details are set forth in order to provide a thoroughunderstanding of various exemplary embodiments or implementations of theinvention. As used herein “embodiments” and “implementations” areinterchangeable words that are non-limiting examples of devices ormethods employing one or more of the inventive concepts disclosedherein. It is apparent, however, that various exemplary embodiments maybe practiced without these specific details or with one or moreequivalent arrangements. In other instances, well-known structures anddevices are shown in block diagram form in order to avoid unnecessarilyobscuring various exemplary embodiments. Further, various exemplaryembodiments may be different, but do not have to be exclusive. Forexample, specific shapes, configurations, and characteristics of anexemplary embodiment may be used or implemented in another exemplaryembodiment without departing from the inventive concepts.

Unless otherwise specified, the illustrated exemplary embodiments are tobe understood as providing exemplary features of varying detail of someways in which the inventive concepts may be implemented in practice.Therefore, unless otherwise specified, the features, components,modules, layers, films, panels, regions, and/or aspects, etc.(hereinafter individually or collectively referred to as “elements”), ofthe various embodiments may be otherwise combined, separated,interchanged, and/or rearranged without departing from the inventiveconcepts.

The use of cross-hatching and/or shading in the accompanying drawings isgenerally provided to clarify boundaries between adjacent elements. Assuch, neither the presence nor the absence of cross-hatching or shadingconveys or indicates any preference or requirement for particularmaterials, material properties, dimensions, proportions, commonalitiesbetween illustrated elements, and/or any other characteristic,attribute, property, etc., of the elements, unless specified. Further,in the accompanying drawings, the size and relative sizes of elementsmay be exaggerated for clarity and/or descriptive purposes. When anexemplary embodiment may be implemented differently, a specific processorder may be performed differently from the described order. Forexample, two consecutively described processes may be performedsubstantially at the same time or performed in an order opposite to thedescribed order. Also, like reference numerals denote like elements.

When an element, such as a layer, is referred to as being “on,”“connected to,” or “coupled to” another element or layer, it may bedirectly on, connected to, or coupled to the other element or layer orintervening elements or layers may be present. When, however, an elementor layer is referred to as being “directly on,” “directly connected to,”or “directly coupled to” another element or layer, there are nointervening elements or layers present. To this end, the term“connected” may refer to physical, electrical, and/or fluid connection,with or without intervening elements. Further, the D1-axis, the D2-axis,and the D3-axis are not limited to three axes of a rectangularcoordinate system, such as the x, y, and z-axes, and may be interpretedin a broader sense. For example, the D1-axis, the D2-axis, and theD3-axis may be perpendicular to one another, or may represent differentdirections that are not perpendicular to one another. For the purposesof this disclosure, “at least one of X, Y, and Z” and “at least oneselected from the group consisting of X, Y, and Z” may be construed as Xonly, Y only, Z only, or any combination of two or more of X, Y, and Z,such as, for instance, XYZ, XYY, YZ, and ZZ. As used herein, the term“and/or” includes any and all combinations of one or more of theassociated listed items.

Although the terms “first,” “second,” etc. may be used herein todescribe various types of elements, these elements should not be limitedby these terms. These terms are used to distinguish one element fromanother element. Thus, a first element discussed below could be termed asecond element without departing from the teachings of the disclosure.

Spatially relative terms, such as “beneath,” “below,” “under,” “lower,”“above,” “upper,” “over,” “higher,” “side” (e.g., as in “sidewall”), andthe like, may be used herein for descriptive purposes, and, thereby, todescribe one elements relationship to another element(s) as illustratedin the drawings. Spatially relative terms are intended to encompassdifferent orientations of an apparatus in use, operation, and/ormanufacture in addition to the orientation depicted in the drawings. Forexample, if the apparatus in the drawings is turned over, elementsdescribed as “below” or “beneath” other elements or features would thenbe oriented “above” the other elements or features. Thus, the exemplaryterm “below” can encompass both an orientation of above and below.Furthermore, the apparatus may be otherwise oriented (e.g., rotated 90degrees or at other orientations), and, as such, the spatially relativedescriptors used herein interpreted accordingly.

The terminology used herein is for the purpose of describing particularembodiments and is not intended to be limiting. As used herein, thesingular forms, “a,” “an,” and “the” are intended to include the pluralforms as well, unless the context clearly indicates otherwise. Moreover,the terms “comprises,” “comprising,” “includes,” and/or “including,”when used in this specification, specify the presence of statedfeatures, integers, steps, operations, elements, components, and/orgroups thereof, but do not preclude the presence or addition of one ormore other features, integers, steps, operations, elements, components,and/or groups thereof. It is also noted that, as used herein, the terms“substantially,” “about,” and other similar terms, are used as terms ofapproximation and not as terms of degree, and, as such, are utilized toaccount for inherent deviations in measured, calculated, and/or providedvalues that would be recognized by one of ordinary skill in the art.

Various exemplary embodiments are described herein with reference tosectional and/or exploded illustrations that are schematic illustrationsof idealized exemplary embodiments and/or intermediate structures. Assuch, variations from the shapes of the illustrations as a result, forexample, of manufacturing techniques and/or tolerances, are to beexpected. Thus, exemplary embodiments disclosed herein should notnecessarily be construed as limited to the particular illustrated shapesof regions, but are to include deviations in shapes that result from,for instance, manufacturing. In this manner, regions illustrated in thedrawings may be schematic in nature and the shapes of these regions maynot reflect actual shapes of regions of a device and, as such, are notnecessarily intended to be limiting.

Unless otherwise defined, all terms (including technical and scientificterms) used herein have the same meaning as commonly understood by oneof ordinary skill in the art to which this disclosure is a part. Terms,such as those defined in commonly used dictionaries, should beinterpreted as having a meaning that is consistent with their meaning inthe context of the relevant art and should not be interpreted in anidealized or overly formal sense, unless expressly so defined herein.

In general, nitride semiconductors described below may be grown byvarious methods well-known to those skilled in the art. For example, thenitride semiconductors may be grown by metal organic chemical vapordeposition (MOCVD), molecular beam epitaxy (MBE), hydride vapor phaseepitaxy (HVPE), or others. In the following exemplary embodiments,semiconductor layers will be described as being grown in a growthchamber by MOCVD. During growth of nitride semiconductors, sourcesintroduced into a chamber may be selected from sources known to thoseskilled in the art, for example, TMGa, TEGa, or others as Ga sources,TMAl, TEAl, or others as Al sources, TMIn, TEIn, or others as Insources, and NH₃ as a N source, without being limited thereto.

In accordance with one exemplary embodiment of the inventive concepts, aUV light emitting diode includes: a substrate; an n-type semiconductorlayer disposed on the substrate; a mesa disposed on the n-typesemiconductor layer and including an active layer and a p-typesemiconductor layer; an n-ohmic contact layer contacting the n-typesemiconductor layer; a p-ohmic contact layer contacting the p-typesemiconductor layer; an n-bump electrically connected to the n-ohmiccontact layer; and a p-bump electrically connected to the p-ohmiccontact layer, wherein the mesa includes a main branch and a pluralityof sub-branches extending from the main branch; the n-ohmic contactlayer surrounds the mesa and is disposed in a region between thesub-branches; and each of the n-bump and the p-bump covers upper andside surfaces of the mesa.

In a typical UV light emitting diode, the p-bump is disposed on the mesaand thus cannot reflect light emitted through the side surface of themesa. On the contrary, according to exemplary embodiments of theinventive concepts, the side surface of the mesa is partially covered bythe n-bump and the p-bump, which reflect UV light emitted through theside surface of the mesa to reenter the substrate.

In addition, since the mesa is disposed not only under the p-bump butalso under the n-bump, the mesa can be distributed over a broad regionof the substrate.

Further, according to the exemplary embodiments, since the mesa includesa main branch and sub-branches, the side surface of the mesa can have anincreased surface area. Accordingly, a region between the mesa and ann-ohmic contact layer is increased to allow UV light emitted through theside surface of the mesa to reenter the substrate through this region,thereby improving light output.

On the other hand, a minimum width of the n-type semiconductor layerexposed between the sub-branches may be greater than or equal to aminimum width of the sub-branches. In a typical UV light emitting diode,the mesa is generally formed to have a greater width than the exposedn-type semiconductor layer, whereas the mesa of the light emitting diodeaccording to the exemplary embodiments is formed to have a narrowerwidth. Accordingly, the light emitting diode according to the exemplaryembodiments allows easy current spreading inside the mesa and canfurther reduce forward voltage.

In some exemplary embodiments, the main branch may have a greaterminimum width than the sub-branches. However, it should be understoodthat the inventive concepts is not limited thereto. Alternatively, themain branch may have the same width as the sub-branches or may have asmaller width than the sub-branches.

The main branch may include a first main branch extending along one sideedge of the substrate and a second main branch extending along anotherside edge of the substrate adjacent to the one side edge of thesubstrate, and the sub-branches may include sub-branches extending fromthe first main branch and sub-branches extending from the second mainbranch.

Herein, the term “main branch” means a branch having a plurality ofbranches branched off from points between opposite ends thereof, and theterm “sub-branch” means a branch connected at one end thereof to themain branch and having the other end in a free standing state (that is,a free end). In addition, when the mesa has two distal ends, the mesacan be referred to as having a single branch, and when the mesa has atleast three distal ends, the mesa can be referred to as having a“plurality of branches”.

The sub-branches may be parallel to each other. In addition, thesub-branches branch off from the same side surface of the main branch.

The sub-branches may be parallel to a diagonal line of the substrate.

The sub-branches may have different lengths. Thus, the mesa can bedisposed over a broad region of the substrate through adjustment of thelengths of the sub-branches.

The substrate may have a rectangular shape having four edges and theshortest distance from each edge to the mesa may be smaller than halfthe shortest distance from each edge to a center of the substrate. In atypical UV light emitting diode, the mesa is biased toward one side ofthe substrate, whereas the UV light emitting diode according to theexemplary embodiments include the mesa broadly disposed in a centralregion of the substrate.

The UV light emitting diode may further include an n-pad metal layercovering the n-ohmic contact layer and a p-pad metal layer covering thep-ohmic contact layer, wherein the n-bump and the p-bump may beconnected to the n-pad metal layer and the p-pad metal layer,respectively.

In some exemplary embodiments, the n-ohmic contact layer may be a metalalloy layer including Cr, Ti, Al and Au; the n-pad metal layer mayinclude a Ti layer/Au layer/Ti layer; and the n-pad metal layer mayadjoin the n-ohmic contact layer.

The UV light emitting diode may further include an insulation layerinterposed between the n-pad metal layer and the p-pad metal layer andbetween the n-bump and the p-pump and having openings exposing the n-padmetal layer and the p-pad metal layer. The insulation layer may becomposed of, for example, an SiO₂ single layer or multiple layers. Theinsulation layer may be a distributed Bragg reflector in whichinsulation layers having difference indices of refraction arealternately stacked one above another.

The openings are shielded by the n-bump and the p-bump, respectively.Accordingly, the n-pad metal layer and the p-pad metal layer exposedthrough the openings may be covered by the n-bump and the p-bump to beprotected from an external environment.

A separation distance between the n-ohmic contact layer and the mesa maybe constant. However, it should be understood that the inventiveconcepts is not limited thereto and the separation distance may beadjusted depending upon locations thereof.

The n-bump and the p-bump may be disposed parallel to each other.

In one embodiment, the mesa may include protrusions formed on the sidesurface thereof. The protrusions further increase the surface area ofthe side surface of the mesa. In addition, the n-ohmic contact layer maybe separated a constant distance from the mesa along the side surface ofthe mesa. Accordingly, the n-ohmic contact layer may be disposed alongthe contour of the protrusions on the side surface of the mesa, therebyincreasing the overall area of a region between the n-ohmic contactlayer and the mesa.

In accordance with another exemplary embodiment of the inventiveconcepts, a UV light emitting diode includes: a substrate; an n-typesemiconductor layer disposed on the substrate; a mesa disposed on then-type semiconductor layer and including an active layer and a p-typesemiconductor layer; an n-ohmic contact layer contacting the n-typesemiconductor layer; a p-ohmic contact layer contacting the p-typesemiconductor layer; an n-bump electrically connected to the n-ohmiccontact layer; and a p-bump electrically connected to the p-ohmiccontact layer, wherein the mesa includes a plurality of branches; then-ohmic contact layer surrounds the mesa and is disposed in a regionbetween the branches; and each of the n-bump and the p-bump covers upperand side surfaces of the mesa, the p-bump covering at least two of thebranches among the plurality of branches.

The branches may include a main branch and a plurality of sub-branchesextending from the main branch.

The main branch may include a first main branch extending along one sideedge of the substrate and a second main branch orthogonal to the firstmain branch.

The p-bump may completely cover the first main branch and may partiallycover the second main branch. Some of the sub-branches may be separatedfrom the p-bump to partially overlap the n-bump.

Hereinafter, exemplary embodiments of the inventive concepts will bedescribed with reference to the accompanying drawings.

FIG. 1 is a plan view of a UV light emitting diode according to oneexemplary embodiment of the inventive concepts and FIGS. 2A and 2B showa cross-sectional view taken along line C-C of FIG. 1. FIG. 3 is aschematic plan view of a mesa according to one exemplary embodiment ofthe inventive concepts.

Referring to FIG. 1, FIGS. 2A and 2B, and FIG. 3, a UV light emittingdiode according to one exemplary embodiment of the inventive conceptsincludes a substrate 121, an n-type semiconductor layer 123, an activelayer 125, a p-type semiconductor layer 127, an n-ohmic contact layer129 a, a p-ohmic contact layer 129 b, an n-pad metal layer 133 a, ap-pad metal layer 133 b, an insulation layer 135, an n-bump 137 a, ap-bump 137 b, and an anti-reflection layer 139.

The substrate 121 may be selected from any substrates that allow growthof nitride semiconductor layers thereon, and may include, for example, aheterogeneous substrate, such as a sapphire substrate, a siliconsubstrate, a silicon carbide substrate, and a spinel substrate, or ahomogeneous substrate, such as a GaN substrate and an AlN substrate.

The n-type semiconductor layer 123 is disposed on the substrate 121. Then-type semiconductor layer 123 may include, for example, an AlN bufferlayer (about 3.79 μm) and an n-type AlGaN layer. The n-type AlGaN layermay include a lower n-type AlGaN layer (about 2.15 μm) having an Almolar ratio of 0.8 or more, an intermediate AlGaN layer (about 1.7 nm)having an Al molar ratio of 0.7 to 0.8, and an upper n-type AlGaN layerhaving a thickness of about 66.5 nm. The n-type semiconductor layer 123is formed of a nitride semiconductor having a broader band-gap than theactive layer so as to allow light generated from the active layer topass therethrough. When a GaN-based semiconductor layer is grown on asapphire substrate 121, the n-type semiconductor layer 123 may generallyinclude a plurality of layers to improve crystal quality.

A mesa M is disposed in some region on the n-type semiconductor layer123. The mesa M includes the active layer 125 and the p-typesemiconductor layer 127. Generally, the mesa M is formed by sequentiallygrowing the n-type semiconductor layer 123, the active layer 125 and thep-type semiconductor layer 127, followed by patterning the p-typesemiconductor layer 127 and the active layer 125 through mesa-etching.

The active layer 125 may have a single-quantum well structure or amulti-quantum well structure including well layers and barrier layers.The well layers are formed of AlGaN or AlInGaN and the barrier layersmay be formed of AlGaN or AlInGaN having a broader band-gap than thewell layers. For example, each of the well layers may be formed of

AlGaN having an Al molar ratio of about 0.5 and have a thickness ofabout 3.1 nm, and each of the barrier layers may be formed of AlGaNhaving an Al molar ratio of about 0.7 or more and have a thickness ofabout 9 nm. In particular, the first barrier layer may have a thicknessof 12 nm or more and may be formed to a greater thickness than otherbarrier layers. Each of the AlGaN layers adjoining upper and lower sidesof each well layer and having a molar ratio of 0.7 to 0.8 may have athickness of about 1 nm. Here, an AlGaN layer adjoining the last welllayer may have an Al molar ratio of 0.8 or more in consideration ofcontact with an electron blocking layer.

The p-type semiconductor layer 127 may include the electron blockinglayer and a p-type GaN contact layer. The electron blocking layerenhances recombination between electrons and holes by preventingoverflow of electrons from the active layer to the p-type semiconductorlayer. The electron blocking layer may be formed of, for example, ap-type AlGaN having an Al molar ratio of about 0.8 and may have athickness of, for example, 55 nm. The p-type GaN contact layer may havea thickness of about 300 nm.

The mesa M includes a plurality of branches M1, M2, S1, S2, S3, and S4.For example, the mesa M may include main branches M1, M2 andsub-branches S1, S2, S3, S4. As shown well in FIG. 5, the mesa M mayinclude a first main branch M1 extending along one side edge of thesubstrate 121 or the n-type semiconductor layer 123 and a second mainbranch M2 extending along another edge thereof adjacent to the one edgethereof. For example, the sub-branches S1, S2 may extend from the firstmain branch M1 and the sub-branches S3, S4 may extend from the secondmain branch M2. Although the main branch is illustrated as beingcomposed of the first main branch M1 and the second main branch M2 forconvenience of description, it should be noted that these main branchesconstitute a single main branch. The second main branch M2 may beomitted.

The sub-branches S1, S2, S3, and S4 may have different lengths and maybe parallel to each other. In particular, the sub-branches S1, S2, S3,and S4 may be disposed parallel to a diagonal line of the substrate 121.As shown best in FIG. 5, the main branches M1, M2 and the sub-branchesS1, S2, S3, and S4 are disposed over a broad region on the substrate121. For example, the substrate 121 may have a quadrilateral shapehaving four edges, for example, a rectangular shape, and the shortestdistance from each of the edges of the substrate 121 to the mesa M maybe smaller than half the shortest distance from each of the edges of thesubstrate 121 to the center thereof.

Referring to FIG. 3, a minimum width W2 of the n-type semiconductorlayer 123 exposed between the sub-branches S1, S2, S3, and S4 may behalf or more a minimum width W1 of the sub-branches S1, S2, S3, and S4.Alternatively, the minimum width W2 of the n-type semiconductor layer123 exposed between the sub-branches S1, S2, S3, and S4 may be greaterthan or equal to the minimum width W1 of the sub-branches S1, S2, S3,and S4. As compared with a conventional technique, the sub-branches S1,S2, S3, and S4 have a relatively small width and the width of the n-typesemiconductor layer 123 exposed between the sub-branches S1, S2, S3, andS4 is relatively increased. With the structure wherein the sub-branchesS1, S2, S3, and S4 are formed to have a relatively narrow width and tobe disposed over a broad region of the substrate 121, the mesa M has anincreased surface area on the side surface thereof.

The main branches M1, and M2 may have a greater width than thesub-branches S1, S2, S3, and S4, without being limited thereto.Alternatively, the width of the main branches M1, and M2 may be smallerthan or equal to the width of the sub-branches S1, S2, S3, and S4.

Referring again to FIG. 1 and FIG. 2, the n-ohmic contact layer 129 a isdisposed on the n-type semiconductor layer 123 exposed around the mesaM. The n-ohmic contact layer 129 a may be formed by depositing aplurality of metal layers, followed by alloying treatment of the metallayers through a rapid thermal alloying (RTA) process. For example, then-ohmic contact layer 129 a may be formed by sequentially depositingCr/Ti/Al/Ti/Au, followed by alloying treatment, for example, at 935° C.within several to dozens of seconds by the RTA process. As a result, then-ohmic contact layer 129 a becomes an alloy layer containing Cr, Ti,Al, and Au.

The n-ohmic contact layer 129 a surrounds the mesa M along thecircumference of the mesa M. In addition, the n-ohmic contact layer 129a is interposed between the sub-branches S1, S2, S3, and S4. The n-ohmiccontact layer 129 a may be separated a constant distance from the mesa Mand may be formed over most of the n-type semiconductor layer 123. Then-ohmic contact layer 129 a is formed along the side surface of the mesaM such that a region free from the n-ohmic contact layer 129 a is formedbetween the mesa M and the n-ohmic contact layer 129 a. Light emittedthrough the side surface of the mesa M may reenter the n-typesemiconductor layer 123 through this region and be discharged throughthe substrate 121. A separation distance between the n-ohmic contactlayer 129 a and the mesa M may be constant along the circumference ofthe mesa M, without being limited thereto.

After formation of the n-ohmic contact layer 129 a, the p-ohmic contactlayer 129 b formed on the mesa M. The p-ohmic contact layer 129 b may beformed through, for example, RTA at about 590° C. for about 80 secondsafter deposition of Ni/Au. The p-ohmic contact layer 129 b forms ohmiccontact with the p-type semiconductor layer 127 and covers most of anupper region of the mesa M, for example, 80% or more of the upper regionthereof.

The n-pad metal layer 133 a and the p-pad metal layer 133 b are formedon the n-ohmic contact layer 129 a and the p-ohmic contact layer 129 b,respectively. The n-pad metal layer 133 a and the p-pad metal layer 133b may be simultaneously formed of the same metals by the same process.For example, each of the n- and p-pad metal layers 133 a, and 133 b mayinclude a Ti layer (300 Å)/Au layer (7,000 Å)/Ti layer (50 Å).

A conventional technique requires a step adjustment layer under then-bump in order to allow thermal-sonic bonding, whereas exemplaryembodiments of the inventive concepts employ solder pastes or AuSnbonding and thus do not require the step adjustment layer. Accordingly,the n-pad metal layer 133 a may directly adjoin the n-ohmic contactlayer 129 a.

Referring to FIG. 2A, the n-pad metal layer 133 a and the p-pad metallayer 133 b are disposed on the n-ohmic contact layer 129 a and thep-ohmic contact layer 129 b through the same areas as the n-ohmiccontact layer 129 a and the p-ohmic contact layer 129 b, respectively,but are not limited thereto. Alternatively, the n-pad metal layer 133 aand the p-pad metal layer 133 b may be disposed thereon through smallerareas than the n-ohmic contact layer 129 a and the p-ohmic contact layer129 b, respectively. Alternatively, referring to FIG. 2B, the n-padmetal layer 133 a and the p-pad metal layer 133 b may cover upper andside surfaces of the n-ohmic contact layer 129 a and the p-ohmic contactlayer 129 b, respectively. In the structure wherein the n and p-padmetal layers 133 a, 133 b cover not only the upper surfaces of the n andp-ohmic contact layers 129 a, and 129 b, but also side surfaces thereof,respectively, the n and p-ohmic contact layers 129 a, and 129 b can beefficiently protected from solders during soldering or AuSn bonding.

The insulation layer 135 covers the n-pad metal layer 133 a and thep-pad metal layer 133 b. The insulation layer 135 has an opening 135 athat exposes the n-pad metal layer 133 a, and an opening 135 b thatpartially exposes the p-pad metal layer 133 b above the mesa M. Theopening 135 a overlaps the n-ohmic contact layer 129 a and the opening135 b overlaps the p-ohmic contact layer 129 b. The opening 135 a andthe opening 135 b may be disposed near opposite edges.

The n-bump 137 a covers the opening 135 a and is connected to the n-padmetal layer 133 a through the opening 135 a. The n-bump 137 a iselectrically connected to the n-type semiconductor layer 123 through then-pad metal layer 133 a and the n-ohmic contact layer 129 a.

The p-bump 137 b covers the opening 135 b and is connected to the p-padmetal layer 133 b through the opening 135 b. The p-bump 137 b iselectrically connected to the p-type semiconductor layer 127 through thep-pad metal layer 133 b and the p-ohmic contact layer 129 b.

The n-bump 137 a and the p-bump 137 b may be formed of, for example,Ti/Au/Cr/Au. The n-bump 137 a and the p-bump 137 b may be disposedparallel to each other, as shown in FIG. 1. The openings 135 a, and 135b are shielded by the n-bump 137 a and the p-bump 137 b to preventexternal moisture or solders from entering through the openings 135 a,and 135 b, thereby improving reliability.

Meanwhile, each of the n-bump 137 a and the p-bump 137 b may partiallycover the side surface of the mesa M. The n-bump 137 a and the p-bump137 b have reflectivity with respect to UV light and thus can reflectlight emitted through the side surface of the mesa M so as to allow thelight to reenter the mesa M.

In the meantime, as shown in FIG. 2A, upper surfaces of the n-bump 137 aand the p-bump 137 b may not be flush with each other due to a heightdifference between the mesa M and the n-pad metal layer 133 a.

The anti-reflection layer 139 is disposed on a light exit surface of thesubstrate 121. The anti-reflection layer 139 may be formed of atransparent insulation material such as SiO₂ and may be formed to athickness, for example, integer times ¼ an ultraviolet wavelength.Alternatively, the anti-reflection layer 139 may be a band pass filterformed by repeatedly stacking layers having different indices ofrefraction.

FIG. 4 is a schematic plan view of a UV light emitting diode accordingto another exemplary embodiment of the inventive concepts.

Referring to FIG. 4, a light emitting diode according to this exemplaryembodiment is substantially similar to the light emitting diodeaccording to the above exemplary embodiment except that a greater numberof sub-branches S1 to S6 is used. As the number of sub-branches S1 to S6increases, the widths of the sub-branches S1 to S6 are further reduced.The sub-branches S1 to S6 may have a similar width and a minimum widthW1 of the sub-branches S1 to S6 may be two times or less of a minimumwidth W2 of the n-type semiconductor layer 123 exposed between thesub-branches. Furthermore, the minimum width W1 of the sub-branches S1to S6 may be smaller than or equal to the minimum width W2 of the n-typesemiconductor layer 123 exposed between the sub-branches. Meanwhile, themain branches M1, and M2 may have a greater width than the sub-branchesS1 to S6, without being limited thereto. Alternatively, the width of themain branches M1, and M2 may be smaller than or equal to the width ofthe sub-branches S1 to S6.

Since the light emitting diode according to this exemplary embodiment issubstantially similar to the light emitting diode according to the aboveexemplary embodiment excluding the shape of the mesa M, detaileddescription thereof will be omitted to avoid repetition and the lightemitting diode according to this exemplary embodiment is schematicallyshown.

FIG. 5 is a schematic plan view of a UV light emitting diode accordingto a further exemplary embodiment of the inventive concepts.

Referring to FIG. 5, a light emitting diode according to this exemplaryembodiment is substantially similar to the light emitting diodedescribed with reference to FIG. 1 to FIG. 3 except for protrusions Pformed on the side surface of the mesa M. The protrusions P may beformed together with the mesa M upon mesa-etching to form the mesa M.

The protrusions P formed on the side surface of the mesa M increase thesurface area on the side surface of the mesa M.

Meanwhile, the n-ohmic contact layer 129 a may be separated a constantdistance from the side surface of the mesa M. Thus, depressions areformed corresponding to the protrusions P along the contour of the sidesurface of the mesa M. The p-ohmic contact layer 129 b may also beformed to have protrusions along the contour of the side surface of themesa M.

FIG. 6 is a schematic sectional view of the UV light emitting diodeaccording to the exemplary embodiment of the inventive concepts, whichis mounted on a submount.

Referring to FIG. 6, the UV light emitting diode is flip-bonded to asubmount substrate 200. The submount substrate 200 may have electrodepads 201 a, 201 b on an insulating substrate, for example, AlN.

The n-bump 137 a and the p-bump 137 b may be bonded to the electrodepads 201 a, 201 b of the submount substrate 200 through solder pastes203 a, and 203 b. Since the UV light emitting diode is bonded to thesubmount substrate through the solder pastes 203 a and 203 b, the uppersurfaces of the n-bump 137 a and the p-bump 137 b are not required to beflush with each other as in typical thermal sonic bonding.

Although bonding is performed using the solder pastes in this exemplaryembodiment, the UV light emitting diode may be bonded to the submountsubstrate 200 through soldering using AuSn.

Exemplary embodiments of the inventive concepts provide a light emittingdiode, in which an n-bump and a p-bump cover a side surface of a mesa toreflect UV light on the side surface of the mesa. Accordingly, the lightemitting diode can reduce loss of UV light emitted through the sidesurface of the mesa. Furthermore, the light emitting diode includes aplurality of branches to increase a surface area of the side surface ofthe mesa, whereby a light reentering region between the side surface ofthe mesa and the n-ohmic contact layer can be increased to allow some ofUV light emitted through the side surface of the mesa to reenter asubstrate.

Although certain exemplary embodiments and implementations have beendescribed herein, other embodiments and modifications will be apparentfrom this description. Accordingly, the inventive concepts are notlimited to such embodiments, but rather to the broader scope of theappended claims and various obvious modifications and equivalentarrangements as would be apparent to a person of ordinary skill in theart.

What is claimed is:
 1. An ultraviolet (UV) light emitting diodecomprising: a substrate; an n-type semiconductor layer disposed on thesubstrate; a mesa disposed on the n-type semiconductor layer andcomprising an active layer and a p-type semiconductor layer; an n-ohmiccontact layer contacting the n-type semiconductor layer; a p-ohmiccontact layer contacting the p-type semiconductor layer; an n-bumpelectrically connected to the n-ohmic contact layer; and a p-bumpelectrically connected to the p-ohmic contact layer, wherein the mesacomprises a plurality of branches, the n-ohmic contact layer surroundsthe mesa and is disposed in a region between the branches, each of then-bump and the p-bump covers an upper surface and a side surface of themesa, and the p-bump covering at least two of the branches among theplurality of branches.
 2. The UV light emitting diode of claim 1,wherein the branches comprise a main branch and a plurality ofsub-branches extending from the main branch.
 3. The UV light emittingdiode of claim 2, wherein the main branch comprises a first main branchextending along one side edge of the substrate and a second main branchorthogonal to the first main branch.
 4. The UV light emitting diode ofclaim 3, wherein the p-bump completely covers the first main branch andpartially covers the second main branch.
 5. The UV light emitting diodeof claim 2, wherein some of the sub-branches are separated from thep-bump to partially overlap the n-bump.